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The Fredenstein Bento 10 is a 19inch, 3U standard rack enclosure for ten Fredenstein F60X modules or other industry standard compatible 500-Series modules.
- Bento 10 is a 19inch, 3U standard rack enclosure for ten Fredenstein F60X modules or other industry standard compatible 500-Series modules.
- Featuring an internal, universal power-supply
- Fredentein's advanced audio routing capabilities significantly reduce wiring complexity.
- The multi-layer backplane ensures lowest noise figures and maximum signal integrity.
Product Name | Fredenstein Bento 10s 500-Series Rack |
---|---|
Brand | Fredenstein |
Condition | New |
MPN | bento10 |
Shipping Option | Free Shipping to the Continental U.S. |
- Bento 10 is a 19inch, 3U standard rack enclosure for ten Fredenstein F60X modules or other industry standard compatible 500-Series modules.
- Featuring an internal, universal power-supply
- Fredentein's advanced audio routing capabilities significantly reduce wiring complexity.
- The multi-layer backplane ensures lowest noise figures and maximum signal integrity.
Fredenstein Bento 10s 500-Series Rack
The Fredenstein Bento 10 is a 19inch, 3U standard rack enclosure for ten Fredenstein F60X modules or other industry standard compatible 500-Series modules.
- Bento 10 is a 19inch, 3U standard rack enclosure for ten Fredenstein F60X modules or other industry standard compatible 500-Series modules.
- Featuring an internal, universal power-supply
- Fredentein's advanced audio routing capabilities significantly reduce wiring complexity.
- The multi-layer backplane ensures lowest noise figures and maximum signal integrity.
Product Name | Fredenstein Bento 10s 500-Series Rack |
---|---|
Brand | Fredenstein |
Condition | New |
MPN | bento10 |
Shipping Option | Free Shipping to the Continental U.S. |
- Bento 10 is a 19inch, 3U standard rack enclosure for ten Fredenstein F60X modules or other industry standard compatible 500-Series modules.
- Featuring an internal, universal power-supply
- Fredentein's advanced audio routing capabilities significantly reduce wiring complexity.
- The multi-layer backplane ensures lowest noise figures and maximum signal integrity.
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